MediaTek is readying a MediaTek Helio X30 chipset which will be manufactured using a 10nm manufacturing process. The Helio X30 will come with ten CPU cores – the Cortex-A35 will be used for non-demanding tasks, while the heavy lifting will be done by “Artemis”.
The Helio X30 is also rumoured to bet on the tri-cluster CPU design, with 2x Artemis cores at 2.8GHz, 4x Cortex-A53 at 2.2GHz, and 4x Cortex-A35 at 2GHz. The Artemis core by ARM design is the successor of the Cortex-A72 and should battle with Qualcomm’s Kryo solution. The A35 is extremely power efficient and offers up to 40% faster performance than its Cortex-A7 predecessor.
The Helio X30 should bring a powerful 4-core PowerVR 7XT GPU and support 26MP snappers, dual camera setups, VR connections, and LTE Cat.13.
Additionally, the X30 will support up to 8GB of RAM and Jiutang also provides a presentation slide, which shows the MediaTek Helio X30 scores 160,000 points on the Antutu benchmark, beating the Snapdragon 820 by 30,000.
Helio X30 manufactured by TSMC’s 10nm FinFET process will be 100% more power-efficient than its Helio X20 generation.
This chipset is billed to debut by early 2017.